Amat P5000

• Applied Materials P5000
• Amat P5000
• Amat P5000 Pecvd
• Amat Pecvd
• Amat P5000 Mxp+ Oxide

• Providing Remanufactured Varian PVD, Novellus PECVD, Applied Materials P5000, Centura and Endura PVD and PECVD Systems.
• Applied Materials P5000 CVD & Etch. Related Projects. Tegal 6500 HRe Dual Frequency Etch. Tegal 901ACS & 903ACS RF Diode Etch. Tegal 981ACS RF Diode.

SSSco supports AMAT P5000 systems and chambers since 2003, delivering high value upgrades, repairs, parts and services. Parts; Upgrades & Retrofits; Services; Available Equipment; P5000 Parts. SSSco ensures high quality parts and modules are delivered to precisely match customer requirements.

Precision 5000^®

The Precision 5000® is a single-wafer, multi-chamber platform for sequential wafer processing. The platform supports sequential processing of wafers ranging in size from 4', 5', 6', or 8'.

The platform supports up to 4 separate process chambers. Wafers are processed in a low vacuum environment.

The multi-chamber design of this platform allows for individual processes in each of the four chambers.

The following chamber types can be added to the system:

Applied Materials P5000

Lamp Heated CVD - Processes include: SACVD, BWCVD, WCVD, TEOS, Nitride

PE TEOS DxZ - DxZ chamber design for better process control for Plasma Enhanced TEOS applications.

PE Silane DxZ - DxZ chamber design for better process control for Plasma Enhanced Silane based applications.

Tungsten WxZ - Tungsten deposition chamber designed for zero edge exclusion. Available with ceramic heater option.

WxP Tungsten Etch (HeWeb)- Tungsten etch back chamber with electrostatic chuck or ceramic clampd process kit, depending on process.

ASP - Advanced Strip Passivation (ASP) chamber used to remove photo resist and passivate the wafer.

ASP+ - Advanced Strip Passivation+ (ASP+) chamber used to remove photo resist and passivate the wafer.

Amat P5000

Oxide MxP+ - Dielectric etch chamber.

Poly Etch MxP - Reactive Ion Etch chamber used for etching Polysilicon films.

Poly Etch MxP+ - Reactive Ion Etch chamber used for etching Polysilicon films.

R2 Metal Etch - Reactive Ion Etch chamber used for etching Metal films.

Metal Etch MxP - Reactive Ion Etch chamber used for etching Metal films.

Mark II Etch - Used for Sputter etch or Reactive Ion Etching.

Orienter - Findes center of the wafer for proper placement. Notch/flat aligns the wafer.

Amat P5000 Pecvd

Single Slot Cooldown - Utilizes a water cooled pedestal to cool the wafer when placed in the chamber. Wafers do not contact the pedestal.

Amat Pecvd

Single Slot Contact Cooldown - Utilizes a water cooled pedestal to cool the wafer when placed in the chamber. Wafers contact the pedestal, allowing for faster cooling, and higher throughput.

Amat P5000 Mxp+ Oxide

Multi-Slot Cooldown - Cools up to eight wafers simultaneously in a water cooled cassette elevator.